AGP Executive Report
Last update: 8 hours agoSemiconductor Strategy: India’s NITI Aayog unveiled a 10-year semiconductor roadmap aiming to build a $120–150B value chain by 2035, with emphasis on advanced packaging, compound semiconductors, wide-bandgap materials and AI-native chip design. Industrial Policy: India’s BHAVYA scheme is set to create investment-ready industrial parks, pushing states to submit investor-centric proposals so sites become operational manufacturing hubs faster. Food Safety Crackdown: Maharashtra FDA arrested 33 people and sealed 27 establishments in a three-day drive targeting adulterated and unsafe food, including packaged drinking water, milk, spices and edible oils. EU Tech Sovereignty: The EU is preparing rules to reduce reliance on US cloud providers and non-European chips, aiming to boost local manufacturing while raising the risk of new transatlantic friction. Steel Import Substitution: Philippines steelmaker SteelAsia is commissioning a structural steel sections mill in Lemery, Batangas, using repatriated OFW technicians to replace 100% imported I-beams and heavy shapes. Offshore Wind Buildout: TotalEnergies filed for a 1.5 GW offshore wind farm offshore Normandy, with €4.5B estimated cost and planned involvement of European turbine and cable suppliers. GLP-1 Access Moves: CVS Caremark expanded Zepbound coverage and removed a block on Foundayo for eligible plans, aiming to widen GLP-1 access while managing costs. Packaging & Manufacturing Scale: EcoModular signed an agreement with IDS and Modul Consult to expand modular building delivery across the GCC, using an AI-native volumetric approach.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.